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HomeUncategorizedSamsung overcomes technical challenges, ready to supply HBM3E chips to Nvidia

Samsung overcomes technical challenges, ready to supply HBM3E chips to Nvidia

Samsung Electronics has resolved the technical hurdles it faced in producing 12-layer HBM3E memory chips, successfully passing Nvidia’s strict qualification tests. According to people familiar with the matter cited by KED Global, the Korean chipmaker will soon begin supplying the high-bandwidth memory required for Nvidia’s AI servers.Read Entire Article…
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